Biography
MC Cheng was born in Kaohsiung, Taiwan and received his B.S. degree from the National Chiao-Tung University, Taiwan. He came to US in 1984 and received the Ph.D. degree in EE from the Polytechnic University, Brooklyn, NY, in 1990. He was with Department of Electrical Engineering, University of New Orleans, New Orleans, LA from 1990-2000 and is currently a professor in the Department of Electrical and Computer Engineering, Clarkson University, Potsdam, NY. His research interests are in the areas of physical modeling and simulation of nano-scale solid-state devices, electro-thermal issues in semiconductor devices and integrated circuits and electromagnetic simulations.
Education Background
Electrical Engineering Ph.D. - 1990 Polytechnic University (Brooklyn)
Systems Engineering M.S. - 1986 Polytechnic University (Brooklyn)
Electrophysics B.S. - 1980 National Chiao Tung University
Teaching Interests
Teaching Interests
Microelectronic circuits, solid-state devices, transport modeling for solid state devices, electromagnetics. Courses taught include:
- ES250 – Electrical Science
- EE311 - EE Junior Lab
- EE341 – Microelectronics
- EE381 - Electromagnetic Fields and Waves
- EE441/541 – Electronic Devices for IC Simulation
- EE641/PH641 – Charge Carrier Transport in Semiconductors
Research Interests
Research Interests
Dr. Cheng’s research interests are in general concerned with effective modeling and simulations of structures involved in carrier transport, heat flow, wave propagation, etc. These include modeling of nanoelectronics devices, thermal and electrothermal simulations of solid-state devices and integrated circuits, simulation of electromagnetics structures, quantum devices and spin transistors, etc.
Current Research
His research currently focuses on physical and numerical modeling of semi-classical and quantum devices, electro-thermal simulations of semiconductor devices and ICs, and electromagnetics simulation.
Awards
- 2013 IOP SELECT, led a study published in IOP SST (Semicon. Science & Tech,), “Modeling of Photovoltaic Cells and Arrays based on Singular Value Decomposition” which was included in the “IOP Select” collection by the IOP editorial boards for its novelty and potential impact on future research (http://www.clarkson.edu/news/news-release_2013-05-07-2.html).
- 2003 Best Paper Award from IEEE Conf. on Electron Devices & Solid-State Circuits in 2003 (EDSSC 2003)
- 1994 Research Initiation Award, National Science Foundation
Patents
- US Patent 8,539,408, “Method for Thermal Simulation”, September 2013, Ming-C. Cheng and Brian T. Helenbrook
Publications
- Ming-C. Cheng, “Reduced-Order Presentation of the Schrödinger Equation”, AIP Advances, vol.6, No. 9, 095121, Sept., 2016.
- Wangkug Jia, Brian Helenbrook, Ming-C. Cheng, “Fast Thermal Simulation of FinFET Circuits Based on a Multi-Block Reduced-Order Model”, IEEE Trans. ICs & Systems, vol. 35, no. 7, pp. 1114-1124, July 2016.
- Wangkug Jia, Brian Helenbrook, Ming-C. Cheng, “Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition”, IEEE Trans. Electron Devices, Vol. 61, No. 8, pp. 2752-2759, August, 2014.
- Ming-C. Cheng, Jeffrey A Smith, Wangkug Jia, Ryan Coleman, “An Effective Thermal Model for FinFET Structure,” IEEE Trans. Electron Devices, Vol. 61, No. 1, pp. 202-206, January 2014.
- Kun Zhang, Wangkun Jia, Jack Koplowitz, Piergiovanni Marzocca, Ming-C. Cheng, “Modeling of Photovoltaic Cells and Arrays Based on Singular Value Decomposition”, Semicond. Sci. & Tech., vol. 28, 035002 (7pp), March 2013. (IOP Select)
- Ravon Venters, Brian Helenbrook Kun Zhang, Ming-C. Cheng, “Proper Orthogonal Decomposition Based Thermal Modeling of Semiconductor Structures,” IEEE Trans. Electron Devices, Vol.59, No. 11, pp. 2924-2931, November 2012.
- Eric Foreman, Peter Habitz, Ming-C. Cheng, Chandu Visweswariah, “A Novel Method for Reducing Metal Variation with Statistical Static Timing Analysis,” IEEE Trans. Comput.-Aided Des. Integr. Circuits and Syst., vol. 31, pp. 1293-1297, August 2012
- Yu Zhang, Pragasen Pillay, Ming-C Cheng, “Magnetic Characteristics and Core losses in Machine Laminations: High Frequency Loss Prediction from Low Frequency Measurements,” IEEE Tran Industry Applications, Vol. 48, No. 2, pp. 623-629, March/April 2012.