25th Anniversary Symposium for Chemical-Mechanical Planarization Held in Lake Placid
The 2023 Annual Symposium for Chemical-Mechanical Planarization (CMP) recently convened in the picturesque setting of Lake Placid, New York, marking a significant milestone as the event celebrated its 25th anniversary.
Organized by Clarkson University’s Center for Advanced Materials Processing (CAMP), the symposium showcased distinguished experts from both the semiconductor industry and academia, alongside prominent leaders from New York State's Empire State Development (ESD), who came together to exchange top-notch research discoveries in the CMP field.
The symposium, which has evolved into a premier platform for knowledge exchange and industry advancement, garnered heightened enthusiasm this year, especially given the catalytic influence of the United States CHIPS and Science Act. This landmark legislation has unleashed unprecedented opportunities for Clarkson University to help the semiconductor industry elevate the United States’ semiconductor ecosystem and foster robust workforce development.
The symposium's program spotlighted key areas of CMP research, encapsulating the industry’s most pressing challenges and innovative equipment solutions. Keynote and plenary lectures from leaders in the field representing companies such as Micron, Samsung, GlobalFoundries, and Applied Materials treated attendees to an insightful outlook for CMP over the next 10 years, offering a glimpse into the future of this critical technology.
The 25th CMP Symposium was a testament to the enduring spirit of innovation and collaboration between Clarkson University and the semiconductor industry. As it looks toward the future, the symposium remains committed to driving progress, with the CHIPS and Science Act as a guiding beacon, ensuring that the United States continues to lead in this vital field.
